Microscopy and Nanomanipulation

Responsible: Dr. Thomas F. Keller

AFM at DESY NanoLab (left) and block copolymer on pre-patterned surfaces before (top right) and after annealing (bottom right)


Versatile high resolution Atomic Force Microscope (Dimension Icon, Bruker)

Major operating modes:
• PeakForce tapping mode with ScanAsyst
• QNM (quantitative nanoscale mechanical characterization)
• Tapping / contact mode
• STM mode (scanning tunneling microscopy)
• Force spectroscopy
• Lateral force microscopy (LFM)
• Magnetic force microscopy (MFM)
• TUNA module (electrical conductivity)
• KPFM module (Kelvin probe force microscopy)

• Icon scanner (90 µm x 90 µm)
• NanoScope V SPM control station
• Optical microscope for laser and sample alignment
• Liquid cell
• Electrochemical cell with potentiostat
• Translation stage for nano-positioning
• Heating stage for in situ analysis (-35 °C - +250 °C)


UHV Atomic Force / Scanning Tunnelling Microscope (LT STM, Scienta Omicron)



Equipment and capabilities include:
• Variable temperature range: 50 K < T < 500 K (liquid N2 and option for He cooling)
• x-y translation stage
• Access for optical microscope
• STM tunneling spectroscopy
• High resolution quartz tuning fork AFM
• Magnetic Force Microscopy (MFM) option
• Direct sample transfer under UHV from/to UHV system

Optical polarization Microscope

Optical Polarization Microscope

High resolution polarization reflection / transmission microscope (Axio Imager M2m, Zeiss)

• Translation stage with motorized z-drive
• Driving range of translation stage 75 mm x 50 mm
• Resolution of Translation stage 0.1 μm
• Reproducibility of translation stage: +/- 1 μm
• Absolute precision of translation stage: +/- 5 μm
• Micro LED for each transmission and reflection mode
• Object holders for transmission and reflection mode
• Universal condensor with options for bright field and dark field imaging
• Polarizer rotatable by 90° with analyzer module for reflection and transmission mode
• Objectives EC Epiplan 5x/0.13; 10x/0.25; 20x/0.4; 50x/0.75;
• Objective EC Epiplan-Neofluar 100x/0.90
• ZEN 2.3 Software (including Multi Channel, Panorama, and Image Analysis Modules)
• ZEN Modul Tiles & Positions for Positioning and R-localization of pre-selected objects
• High Performance Microscopy camera Axiocam 503 color

High resolution SEM

High-Resolution SEM

High resolution field emission SEM (Nova Nano SEM 450, FEI Thermofisher)

• SE Everhart-Thornley detector (ETD)
• Low vacuum BE detector
• High resolution through-lens detector tunable for SE and BE mode
• High resolution STEM detector for analysis of membranes and thin films in transmission
• IR-CCD camera to track the sample position
• X-Max 150 EDS silicon drift detector for elemental analysis, energy resolution 127 eV @ MnKα (Oxford)
• C-Nano EBSD CMOS detector with AZtecHKL software (Oxford)

Lateral resolution:
• 1.0 nm at 15 kV
• 1.4 nm at 1 kV
• 0.8 nm at 30 kV (STEM)

• Possible translation of sample stage in x/y: 110 x 110 mm
• Navigation and pattering software
• Low vacuum mode
• Beam deceleration option to analyze isolating sample surfaces
• Dynamical tilt
• Gas injection system to write Pt based markers on sample surfaces via electron beam-induced deposition

Dual beam FIB


Dual-beam focused ion beam instrument (SCIOS, FEI Thermofisher)

(Verbundforschungsprojekt Nr. 05K13WC3, University of Bayreuth)

• SE Everhart-Thornley detector (ET-SED)
• In-lens detectors: Lower (T1) and Upper (T2)
• EDAX element silicon drift detector system
• IR-CCD camera to track the sample position

Lateral resolution, electron imaging:
• 1.0 nm at 30 kV
• 1.6 nm at 1 kV
• 2.5 nm at 1 kV at eucentric working distance

Ion optics:
• Voltage: 500 V to 30 kV
• Beam current: 1.5 pA - 65 nA in 15 steps
• Lateral resolution: 3.0 nm

• Nano-manipulator EasyLift EX
• Platinum deposition (Pt) via gas injection system
• Beam deceleration

• Translation of eucentric sample stage in x/y: 110 x 110 mm
• Navigation and pattering software
• Integrated plasma cleaner

• Cross section sample preparation
• Nano- and micro-manipulation
• 3D tomographic imaging - Auto Slice & View
  with electron and elemental EDX contrast
  3D reconstruction with Amira-Avizo Software

Scanning Auger Microscope (SAM)

  • PHI 710 Scanning Auger Nanoprobe instrument
  • Energy range, electrons, 1-25 keV
  • Nominal lateral resolution < 10 nm (elements with low concentrations)
  • Coaxial cylindrical mirror analyser
  • Argon ion gun (5 kV) for surface cleaning, charge neutralization and Auger compositional depth profiling
  • Image registration to enhance imaging stability
  • Motorized five-axis specimen stage
  • Intro camera and ion gauge
  • Navigation software to re-localize pre-defined positions on the sample surface


SAM at DESY NanoLab (left) and Auger elemental maps of alloy nanoparticles (right)

Nano-Object Transfer & Positioning

Nano-Object Transfer & Positioning was developed within the European Horizon 2020 framework programme for research and innovation Nanoscience Foundries and Fine Analysis (NFFA) under grant agreement no. 654360.

The offer comprises an advanced design of hierarchically arranged markers tailored to specific requirements, the subsequent deposition of the markers by electron- and ion-beam induced deposition (IBID/EBID), and a software tool that translates the position coordinates between the nano-science instruments via the marker system. IBID/EBID markers are deposited inside the FIB/SEM using platinum (Pt) containing precursor material, making them suitable for localization by electron or X-ray excited Pt fluorescence, absorption, and their topography contrast.

Sputter Coater

Sputter Coater

High vacuum magnetron sputter coating system (EM ACE600, Leica)
• Different sputter target materials (Cr, etc., on request)
• Carbon thread for carbon film deposition (for, e.g., EDX, EBSD)
• Nominal end pressure 2 × 10 E-6 mbar
• Tuneable coating thickness
• Quartz crystal microbalance for monitoring the coating thickness
• Automatic rotation of sample stage
• Maximum sample size up to 4” wafers (104 mm diameter)

contact: Thomas F. Keller

Tel.: +49 (0) 40 - 8998-6010